Currently on the market for LED chip packaging in single package-based, single package as only used in 1 to 4 LED lights astigmatism, astigmatism lights time is short, so heat buildup is not obvious. As used in the fluorescent lamp, should be closely aligned and longer light up, so in the limited space for heat dissipation is difficult in a timely manner will be excluded from these hot outside.
LED chip is characterized by an extremely high heat in a very small volume. The LED itself thermal capacity is small, it must take the shortest time to deliver the heat out, otherwise you will have a very high junction temperature.
Although the LED chip architecture and raw materials is one of the factors affecting the size of the LED thermal resistance, reducing the LED itself thermal resistance is pre-condition, but after a limited impact on improving the cooling capacity, so by selecting the appropriate LED packaging technology become LED conduct the main design of the cooling method. Table 1 lists the common market, several different packaging technology LED thermal resistance.
Visible LED packages using COB technology packaging process as compared to other thermal resistance is minimized.
